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- me-6776 - microelec-sys-packaging
Georgia Institute of Technology-Main Campus Course Info
Atlanta, Georgia•
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Course Info
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ME 6776
Microelec Sys Packaging
Broad overview of system-level, cross-disciplinary microelectronics packaging technologies, including design, test, thermal, reliability, optoelectronics, and RF integration. Comparison of system-on-chip and system-on-package. Crosslisted with ECE and MSE 6776.
Units: 3.0